PACKAGING INFORMATION
Plastic TSOP 66-pin
Package Code: T (Type II)
N
N/2+1
Notes:
1. Controlling dimension: millimieters,
unless otherwise specified.
2. BSC = Basic lead spacing between
centers.
3. Dimensions D and E1 do not include
mold flash protrusions and should be
measured from the bottom of the
E
E1
package
.
4. Formed leads shall be planar with
respect to one another within 0.004
inches at the seating plane.
1
N/2
D
SEATING PLANE
A
ZD
L
α
e
b
C
A1
Plastic TSOP (T - Type II)
Millimeters
Inches
Symbol Min
Max
Min
Max
Ref. Std.
No. Leads (N)
66
A
A1
A2
b
C
D
E1
E
e
—
1.20
—
0.047
0.05 0.15
—
0.002 0.006
—
—
—
0.24 0.40
0.12 0.21
22.02 22.42
10.03 10.29
11.56 11.96
0.65 BSC
0.009 0.016
0.005 0.0083
0.867 0.8827
0.395 0.405
0.455 0.471
0.026 BSC
L
0.40 0.60
0.016 0.024
L1
ZD
α
—
—
—
—
0.71 REF
0° 8°
0.028 REF
0°
8°
Integrated Silicon Solution, Inc. — 1-800-379-4774
1
Rev. A
08/09/05
ISSI [ INTEGRATED SILICON SOLUTION, INC ]
