AS7C33256PFS32A
AS7C33256PFS36A
®
AC test conditions
• Output load: see Figure B, except for t , t
, t
, t , see Figure C.
LZC LZOE HZOE HZC
• Input pulse level: GND to 3V. See Figure A.
Thevenin equivalent:
• Input rise and fall time (measured at 0.3V and 2.7V): 2 ns. See Figure A.
• Input and output timing reference levels: 1.5V.
+3.3V for 3.3V I/O;
/+2.5V for 2.5V I/O
319Ω / 1667Ω
Z = 50
Ω
50
Ω
0
D
OUT
V = 1.5V
+3.0V
D
L
OUT
90%
10%
90%
10%
5 pF*
for 3.3V I/O;
353Ω / 1538Ω
30 pF*
= V
/2
DDQ
GND
*including scope
and jig capacitance
GND
for 2.5V I/O
Figure A: Input waveform
Figure B: Output load (A)
Figure C: Output load (B)
Notes
1
2
3
4
5
6
For test conditions, see AC Test Conditions, Figures A, B, C.
This parameter measured with output load condition in Figure C.
This parameter is sampled, but not 100% tested.
t
is less than t
; and t
HZC
is less than t at any given temperature and voltage.
LZC
HZOE
LZOE
tCH measured as HIGH above V and tCL measured as LOW below V .
IH IL
This is a synchronous device. All addresses must meet the specified setup and hold times for all rising edges of CLK. All other synchronous inputs must meet
the setup and hold times for all rising edges of CLK when chip is enabled.
Write refers to GWE, BWE, BW[a:d].
7
8
Chip select refers to CE0, CE1, CE2.
4/15/02; v.1.9
Alliance Semiconductor
P. 12 of 14
ISSI [ INTEGRATED SILICON SOLUTION, INC ]
