®
PACKAGINGINFORMATION
ISSI
Plastic TSOP
Package Code: T (Type II)
N
N/2+1
Notes:
1. Controlling dimension: millimeters, unless otherwise
specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E do not include mold flash protru-
sions and should be measured from the bottom of the
E
E1
package
.
4. Formed leads shall be planar with respect to one another
within 0.004 inches at the seating plane.
1
N/2
D
SEATING PLANE
A
L
α
e
b
c
A1
Plastic TSOP (T - Type II) (MS 25)
Plastic TSOP (T - Type II) (MS 24)
Millimeters Inches
Min Max
Plastic TSOP (T - Type II) (MS 24)
Millimeters Inches
Min Max
Millimeters
Inches
Min Max
Symbol Min
Max
Symbol Min
Max
Symbol Min
Max
Ref. Std.
Ref. Std.
Ref. Std.
N
A
A1
b
c
D
24/26
N
A
A1
b
c
D
40/44
N
A
A1
b
c
D
44/50
1.20
0.05 0.15
0.30 0.51
0.12 0.21
0.0472
1.20
0.05 0.15
0.30 0.45
0.12 0.21
0.0472
1.20
0.05 0.15
0.30 0.45
0.12 0.21
0.0472
0.002 0.0059
0.012 0.0201
0.005 0.0083
0.670 0.6899
0.295 0.3051
0.050 BSC
0.002 0.0059
0.012 0.0157
0.005 0.0083
0.721 0.7287
0.396 0.4040
0.031 BSC
0.002 0.0059
0.012 0.0157
0.005 0.0083
0.821 0.8287
0.396 0.4040
0.031 BSC
17.01 17.27
7.49 7.75
1.27 BSC
18.31 18.51
10.06 10.26
0.80 BSC
20.85 21.05
10.06 10.26
0.80 BSC
E
E
E
1
e
1
1
e
e
E
L
α
9.02 9.42
0.40 0.60
0.462 0.4701
0.016 0.0236
E
L
α
11.56 11.96
0.40 0.60
0.455 0.4709
0.016 0.0236
E
L
α
11.56 11.96
0.40 0.60
0.455 0.4709
0.016 0.0236
0°
5°
0°
5°
0°
8°
0°
8°
0°
8°
0°
8°
Integrated Silicon Solution, Inc.
PK13197T40 Rev. C 08/013/99
ISSI [ INTEGRATED SILICON SOLUTION, INC ]
