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IRFP460APBF 参数 Datasheet PDF下载

IRFP460APBF图片预览
型号: IRFP460APBF
PDF下载: 下载PDF文件 查看货源
内容描述: 开关电源MOSFET( VDSS = 500V , RDS ( ON)最大值= 0.27ヘ, ID = 20A ) [SMPS MOSFET ( VDSS=500V , RDS(on)max=0.27ヘ , ID=20A )]
分类和应用: 晶体开关晶体管功率场效应晶体管脉冲PC局域网
文件页数/大小: 9 页 / 191 K
品牌: INFINEON [ Infineon ]
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IRFP460APbF  
Static @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
Conditions  
VGS = 0V, ID = 250µA  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
500 ––– –––  
––– 0.61 –––  
––– ––– 0.27  
V
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient  
V/°C Reference to 25°C, ID = 1mA  
VGS = 10V, ID = 12A „  
RDS(on)  
VGS(th)  
Static Drain-to-Source On-Resistance  
Gate Threshold Voltage  
2.0  
––– 4.0  
V
VDS = VGS, ID = 250µA  
––– ––– 25  
––– ––– 250  
––– ––– 100  
––– ––– -100  
VDS = 500V, VGS = 0V  
IDSS  
Drain-to-Source Leakage Current  
µA  
VDS = 400V, VGS = 0V, TJ = 125°C  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
VGS = 30V  
IGSS  
nA  
VGS = -30V  
Dynamic @ TJ = 25°C (unless otherwise specified)  
Parameter  
Forward Transconductance  
Total Gate Charge  
Min. Typ. Max. Units  
Conditions  
VDS = 50V, ID = 12A  
ID = 20A  
gfs  
11 ––– –––  
S
Qg  
––– ––– 105  
––– ––– 26  
––– ––– 42  
Qgs  
Qgd  
td(on)  
tr  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
nC VDS = 400V  
VGS = 10V, See Fig. 6 and 13 „  
–––  
–––  
–––  
–––  
18 –––  
55 –––  
45 –––  
39 –––  
VDD = 250V  
ID = 20A  
ns  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
RG = 4.3Ω  
RD = 13,See Fig. 10 „  
VGS = 0V  
Ciss  
Coss  
Crss  
Coss  
Coss  
Input Capacitance  
––– 3100 –––  
––– 480 –––  
Output Capacitance  
Reverse Transfer Capacitance  
Output Capacitance  
Output Capacitance  
Effective Output Capacitance  
VDS = 25V  
–––  
18 –––  
pF  
ƒ = 1.0MHz, See Fig. 5  
VGS = 0V, VDS = 1.0V, ƒ = 1.0MHz  
VGS = 0V, VDS = 400V, ƒ = 1.0MHz  
VGS = 0V, VDS = 0V to 400V ꢀ  
––– 4430 –––  
––– 130 –––  
––– 140 –––  
Coss eff.  
Avalanche Characteristics  
Parameter  
Typ.  
Max.  
960  
20  
Units  
mJ  
EAS  
IAR  
Single Pulse Avalanche Energy‚  
–––  
–––  
–––  
Avalanche Current  
A
EAR  
Repetitive Avalanche Energy  
28  
mJ  
Thermal Resistance  
Parameter  
Junction-to-Case  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
Typ.  
–––  
0.24  
–––  
Max.  
0.45  
–––  
40  
Units  
RθJC  
RθCS  
RθJA  
°C/W  
Diode Characteristics  
Parameter  
Min. Typ. Max. Units  
Conditions  
D
S
IS  
Continuous Source Current  
(Body Diode)  
MOSFET symbol  
20  
80  
––– –––  
––– –––  
showing the  
A
G
ISM  
Pulsed Source Current  
(Body Diode)   
integral reverse  
p-n junction diode.  
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse RecoveryCharge  
Forward Turn-On Time  
––– ––– 1.8  
––– 480 710  
––– 5.0 7.5  
V
TJ = 25°C, IS = 20A, VGS = 0V „  
ns  
TJ = 25°C, IF = 20A  
Qrr  
ton  
µC di/dt = 100A/µs „  
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
2
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