CD4060BMS
Test Circuits (Continued)
11
RC
10
9
C1
RS
C2
NOTE:
CXTAL = C1 + C2 + CSTRAY
RC = Broader frequency
response
RS = Current limiting
FIGURE 11. TYPICAL CRYSTAL CIRCUIT
Chip Dimensions and Pad Layout
Dimension in parenthesis are in millimeters
and are derived from the basic inch dimensions
as indicated. Grid graduations are in mils (10-3 inch).
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
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