CD4006BMS
Typical Performance Characteristics (Continued)
AMBIENT TEMPERATURE (TA) = +25oC
SUPPLY VOLTAGE (VDD) = 15V
8
6
4
2
104
103
10V
10V
8
6
4
5V
2
8
6
4
2
102
10
8
6
4
CL = 50pF
CL = 15pF
2
2
4 6 8
2
4
6 8
2
4 6 8
2
4 6 8
2
4 6
1
10
INPUT FREQUENCY (fCL) (kHz)
102
103
104
FIGURE 7. TYPICAL DYANAMIC POWER DISSIPATION
AS A FUNCTION OF CLOCK FREQUENCY
Chip Dimensions and Pad Layout
Dimensions in parentheses are in millimeters
and are derived from the basic inch dimensions
as indicated. Grid graduations are in mils (10-3 inch)
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
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