AD7523, AD7533
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
101 mils x 103 mils (2565micrms x 2616micrms)
Type: PSG/Nitride
PSG: 7 ±1.4kÅ
Nitride: 8 ±1.2kÅ
METALLIZATION:
Type: Pure Aluminum
Thickness: 10 ±1kÅ
PROCESS:
CMOS Metal Gate
Metallization Mask Layout
AD7523, AD7533
PIN 4
BIT 1
(MSB)
PIN 7
BIT 4
PIN 6
BIT 3
PIN 5
BIT 2
PIN 3
GND
PIN 2
PIN 8
BIT 5
I
2
OUT
PIN 1
I
1
OUT
PIN 9
BIT 6
PIN 10
BIT 7
PIN 16
R
FEEDBACK
PIN 11
BIT 8
(LSB)
PIN 15
V
REF
NC
(PIN 12, BIT 9, AD7533)
NC
NC
NC
PIN 14
V+
(PIN 13, BIT 10, AD7533)
10-15