欢迎访问ic37.com |
会员登录 免费注册
发布采购

5962R1222201VXC 参数 Datasheet PDF下载

5962R1222201VXC图片预览
型号: 5962R1222201VXC
PDF下载: 下载PDF文件 查看货源
内容描述: 抗辐射双路36V精密单电源,轨到轨输出,低功耗运算放大器 [Rad Hard Dual 36V Precision Single-Supply, Rail-to-Rail Output, Low-Power Operational Amplifiers]
分类和应用: 运算放大器
文件页数/大小: 20 页 / 1049 K
品牌: INTERSIL [ Intersil ]
 浏览型号5962R1222201VXC的Datasheet PDF文件第12页浏览型号5962R1222201VXC的Datasheet PDF文件第13页浏览型号5962R1222201VXC的Datasheet PDF文件第14页浏览型号5962R1222201VXC的Datasheet PDF文件第15页浏览型号5962R1222201VXC的Datasheet PDF文件第16页浏览型号5962R1222201VXC的Datasheet PDF文件第17页浏览型号5962R1222201VXC的Datasheet PDF文件第18页浏览型号5962R1222201VXC的Datasheet PDF文件第19页  
ISL70218SEH  
Ceramic Metal Seal Flatpack Packages (Flatpack)  
K10.A MIL-STD-1835 CDFP3-F10 (F-4A, CONFIGURATION B)  
10 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE  
e
A
INCHES MILLIMETERS  
MIN  
A
D
SYMBOL  
MAX  
0.115  
0.022  
0.019  
0.009  
0.006  
0.290  
0.260  
0.280  
-
MIN  
1.14  
0.38  
0.38  
0.10  
0.10  
-
MAX  
2.92  
0.56  
0.48  
0.23  
0.15  
7.37  
6.60  
7.11  
-
NOTES  
-A-  
-B-  
PIN NO. 1  
ID AREA  
A
b
0.045  
0.015  
0.015  
0.004  
0.004  
-
-
b
-
E1  
b1  
c
-
S1  
0.004  
H
A - B  
D
0.036  
H
A - B  
D
M
S
S
M
S
S
-
c1  
D
E
-
3
0.240  
-
6.10  
-
-
C
Q
E
E1  
E2  
E3  
e
3
-D-  
A
0.125  
0.030  
3.18  
0.76  
-
-H-  
-C-  
-
-
7
L
E2  
L
E3  
E3  
0.050 BSC  
1.27 BSC  
-
SEATING AND  
BASE PLANE  
c1  
LEAD FINISH  
k
0.008  
0.250  
0.026  
0.005  
-
0.015  
0.370  
0.045  
-
0.20  
6.35  
0.66  
0.13  
-
0.38  
9.40  
1.14  
-
2
L
-
BASE  
METAL  
Q
S1  
M
N
8
(c)  
6
b1  
0.0015  
0.04  
-
M
M
(b)  
10  
10  
-
SECTION A-A  
Rev. 0 3/07  
NOTES:  
1. Index area: A notch or a pin one identification mark shall be located ad-  
jacent to pin one and shall be located within the shaded area shown.  
The manufacturer’s identification shall not be used as a pin one identi-  
fication mark. Alternately, a tab (dimension k) may be used to identify  
pin one.  
2. If a pin one identification mark is used in addition to a tab, the limits of  
dimension k do not apply.  
3. This dimension allows for off-center lid, meniscus, and glass overrun.  
4. Dimensions b1 and c1 apply to lead base metal only. Dimension M ap-  
plies to lead plating and finish thickness. The maximum limits of lead  
dimensions b and c or M shall be measured at the centroid of the fin-  
ished lead surfaces, when solder dip or tin plate lead finish is applied.  
5. N is the maximum number of terminal positions.  
6. Measure dimension S1 at all four corners.  
7. For bottom-brazed lead packages, no organic or polymeric materials  
shall be molded to the bottom of the package to cover the leads.  
8. Dimension Q shall be measured at the point of exit (beyond the menis-  
cus) of the lead from the body. Dimension Q minimum shall be reduced  
by 0.0015 inch (0.038mm) maximum when solder dip lead finish is  
applied.  
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.  
10. Controlling dimension: INCH.  
FN7957.1  
August 24, 2012  
20  
 复制成功!