Crane Aerospace & Electronics Power Solutions
MSA/MGA Single and Dual DC-DC Converters
28 Vꢀꢁꢂ ꢃꢄpꢅꢂ – 5 WAꢂꢂ
TOP VIEW CASE D1
CASE D1 GULL-WING PADS
0.090 (2.29)
1
2
3
4
5
6
7
8
9
20
19
18
17
16
15
14
13
12
11
1.000 (25.40)
0.900 (22.86)
0.800 (20.32)
0.700 (17.78)
0.600 (15.24)
0.500 (12.70)
0.400 (10.16)
0.300 ( 7.62)
0.200 ( 5.08)
0.100 ( 2.54)
0.102 (2.59)
1.000 (25.40)
0.030 (0.76)
(This view shows
straight leads.)
1.110 max
(28.19)
0.015
(0.38)
10
1.000
(25.40)
0.000
1.110 max
(28.19)
0.100 (2.54) 18X
0.050 (1.27) 4X
The triangle (ESD) marking on the cover indicates pin one.
Cover marking is oriented with pin one at the upper right corner.
The straight lead configuration does not require a “case designator”
in the model number. ex. MGA2805S
Dimensions in inches (mm)
Tolerance±0.005 (0.13) for three decimal places ±0.01 (0.3) for
two decimal places, unless otherwise specified.
Please refer to the numerical dimensions for accuracy.
0.08
(2.0)
0.50
(12.7)
2.115 ref. (53.72)
Straight Leads
CAUTION:
0.010
(0.25)
Internal components are soldered with SN96 (melting
temperature 221°C) to prevent damage during reflow. Maximum
reflow temperature for surface mounting the MGA converter is
220°C for a maximum of 30 seconds. SN60, 62, or 63 are the
recommended types of solder.
0.250 max.
(6.35)
Seam seal
1.35 ref. (34.29)
0.125 ref.
(3.18)
Hand soldering should not exceed 300°C for 10 seconds per pin.
The gull wing option
(configuration) requires
“Z” as a “case
designator”
in the model number.
ex. MGA2805Z
Gull Wing Leads
Option
1
0.010
(0.25)
SOLDER MASK NOTES
1. Pad dimensions are for the solder mask. Leads common to
each other can be connected to each other as desired.
1
Leads are solder dipped and lead
dimensions are prior to solder dip.
0.055
(1.40)
2. Ground (case) pins should be connected to the center pad for
improved grounding.
0.010 (0.25)
Bottom of lead to
bottom of case
(Center to center)
3. Connect "no connection" pins to case ground to reduce EMI.
0.08
(2.0)
4. Center pad should not have a solder mask. Solder, copper, or
Au/Ni plate are preferred over solder mask for adhesive attach.
0.070
(1.78)
5. Pre-tin base of converter prior to soldering.
Weight: 15 grams max.
6. If less rotation of case is desired, reduce the width of the large
case pad by 0.020 inches (0.51 mm). Pad length can be
extended 0.010 inches (0.25 mm) towards the case body and an
as-desired dimension away from the case body.
Dimensions in inches (mm)
Tolerance±0.005 (0.13) for three decimal places,
±0.01 (0.3) for two decimal places, unless otherwise specified
Please refer to the numerical dimensions for accuracy.
7. Do not exceed 220°C as measured on the body of the
converter (top or bottom).
CAUTION
8. Attach the body of the case to the board with a thermally
conductive adhesive or SN60, 62, or 63 solder. The adhesive
can be electrically conductive as well. It can be applied as an
underfill post solder or dispensed and cured prior or during
solder.
Maximum reflow temperature is 220°C for a maximum of 30 seconds.
SN60, SN62, or SN63 are the recommended types of solder. See MGA
gull-wing solder pads layout. Hand soldering should not exceed 300°C
for 10 seconds per pin.
9. In the presence of vibration, to ensure reliable mechanical
attachment, the body of the case should be attached with
adhesive or solder as noted above (note 8). The leads alone do
not provide sufficient mechanical attachment.
Materials
Header Kovar/Nickel/Gold
Cover
Pins
Kovar/Nickel
Kovar/Nickel/Gold matched glass seal
Gold plating of 50 - 225 microinches is included in pin diameter
Seal hole: 0.040 ±0.002 (1.02 ±0.05)
Case D1 MGA Solder Pads, Rev F, 2013.05.31
Case D1, Rev D, 2013.04.22
Figure 27: mga Case Dimensions
Figure 28: mga gull-Wing solDer paD layout
surFaCe mount Case anD leaD options
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MSA_MGAꢀRevꢀACꢀ-ꢀ2013.06.13
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