£
Intel Advanced+ Boot Block Flash Memory (C3)
Figure 20. TSOP Package Drawing & Dimensions
Z
A
2
See Notes 1, 2, 3 and 4
Pin 1
e
See Detail B
E
Y
D
1
A
1
D
Seating
Plane
See Detail A
A
Detail A
Detail B
C
b
0
L
A5568-02
Dimensions
Family: Thin Small Ou-tLine Package
Symbol
Millimeters
Nom
Inches
Nom
Min
Max
1.200
Notes
Min
Max
Notes
Package Height
Standoff
A
A1
A2
b
0.047
0.050
0.002
Package Body Thickness
Lead Width
0.950 1.000 1.050
0.150 0.200 0.300
0.100 0.150 0.200
18.200 18.400 18.600
11.800 12.000 12.200
0.500
0.037 0.039 0.041
0.006 0.008 0.012
0.004 0.006 0.008
0.717 0.724 0.732
0.465 0.472 0.480
0.0197
Lead Thickness
c
Plastic Body Length
Package Body Width
Lead Pitch
D1
E
e
Terminal Dimension
Lead Tip Length
Lead Count
D
19.800 20.000 20.200
0.500 0.600 0.700
48
0.780 0.787 0.795
0.020 0.024 0.028
48
L
N
Lead Tip Angle
Ø
Y
0°
3°
5°
0°
3°
5°
Seating Plane Coplanarity
Lead to Package Offset
0.100
0.004
Z
0.150 0.250 0.350
0.006 0.010 0.014
1. One dimple on package denotes Pin 1.
2. If two dimples, then the larger dimple denotes Pin 1.
3. Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
4. Pin 1 will always supersede above pin one notes.
Datasheet
65
INTEL [ INTEL ]
