8XC52/54/58
PROCESS INFORMATION
PACKAGES
Part
Prefix
Package Type
This device is manufactured on P629.0, a CHMOS
III-E process. Additional process and reliability infor-
mation is available in Intel’s Components Quality
and Reliability Handbook, Order No. 210997.
8XC5X
87C5X
8XC5X
8XC5X
P
D
N
S
40-Pin Plastic DIP (OTP)
40-Pin CERDIP (EPROM)
44-Pin PLCC (OTP)
44-Pin QFP (OTP)
272336–3
PLCC
272336–2
DIP
272336–4
*Do not connect reserved pins.
QFP
Figure 2. Pin Connections
3