3 Volt Intel® Advanced+ Boot Block Flash Memory Stacked-CSP Family
Table 32. Packaging Specifications (0.13µm)
Millimeters
Inches
Nom
Sym
Min
Nom
Max
Min
Max
Package Height
1. 200
0.0472
16/02-Mb, 16/04-Mb, 32/08-Mb
A
Package Height
32/04-Mb
1. 400
0.0551
Ball Height
0.200
0.250
0.0079
0.0098
16/02-Mb, 16/04-Mb, 32/08-Mb
A1
A2
b
Ball Height
32/04-Mb
Package Body Thickness
0.860
0.960
0.375
0.40
0.0339
0.0378
0.0148
0.0157
0.3937
0.4724
0.3150
16/02-Mb, 16/04-Mb, 32/08-Mb
Package Body Thickness
32/04-Mb
Ball (Lead) Width
0.325
0.350
9.900
11.900
7.900
0.425
0.450
0.0128
0.0138
0.3898
0.4685
0.3110
0.0167
0.0177
0.3976
0.4764
0.3189
16/02-Mb, 16/04-Mb, 32/08-Mb
Ball (Lead) Width
32/04-Mb
Package Body Length
16/02-Mb, 16/04-Mb
10.000
12.000
8.000
10.100
12.100
8.100
D
E
Package Body Length
32/04-Mb, 32/08-Mb
Package Body Width
16/02-Mb, 16/04-Mb, 32/04-Mb, 32/08-Mb
Pitch
e
N
Y
0.800
66
0.0315
66
Ball (Lead) Count
Seating Plane Coplanarity
0.100
1.300
0.0039
0.0512
Corner to Ball A1 Distance Along E
S1
1.100
1.200
0.0433
0.0472
16/02-Mb, 16/04-Mb, 32/04-Mb, 32/08-Mb
Corner to Ball A1 Distance Along D
16/02-Mb, 16/04-Mb
S2
S2
0.500
1.500
0.600
1.600
0.700
1.700
0.0197
0.0591
0.0236
0.0630
0.0276
0.0669
Corner to Ball A1 Distance Along D
32/04-Mb, 32/08-Mb
66
Datasheet
INTEL [ INTEL ]
