£
Intel Advanced+ Boot Block Flash Memory (C3)
Figure 21. Easy BGA Package Drawing & Dimension
Ball A1
Corner
Ball A1
Corner
D
S1
1
2
3
4
5
6
7
8
8
7
6
5
4
3
2
1
S2
A
B
C
D
E
A
B
C
D
E
b
e
E
F
F
G
H
G
H
Top View - Ball side down
A1
Bottom View - Ball Side Up
A2
A
Seating
Plane
Y
Side View
Note: Drawing not to scale
Dimensions Table
Millimeters
Min
Inches
Min
Symbol
A
Nom
Max Notes
1.200
Nom
Max
Package Height
0.0472
1
Ball Height
A
A
0.250
0.0098
2
Package Body Thickness
Ball (Lead) Width
Package Body Width
Package Body Length
Pitch
Ball (Lead) Count
Seating Plane Coplanarity
Corner to Ball A1 Distance Along D
Corner to Ball A1 Distance Along E
0.780
0.430
10.000
13.000
1.000
64
0.0307
0.0169
0.3937
0.5118
0.0394
64
b
D
E
[e]
N
Y
0.330
9.900
12.900
0.530
10.100
13.100
0.0130
0.3898
0.5079
0.0209
0.3976
0.5157
1
1
0.100
1.600
3.100
0.0039
0.0630
0.1220
1
S
S
1.400
2.900
1.500
3.000
1
1
0.0551
0.1142
0.0591
0.1181
2
Note: (1) Package dimensions are for reference only. These dimensions are estimates based
on die size, and are subject to change.
66
Datasheet
INTEL [ INTEL ]
