Contents
1
Introduction.....................................................................................................6
1.1
1.2
1.3
Major Features.......................................................................................6
Terminology ..........................................................................................7
References ............................................................................................9
2
Low Power Features ........................................................................................10
2.1
Clock Control and Low-power States .......................................................10
2.1.1
2.1.2
Thread Low-power State Descriptions.........................................12
Package Low-power State Descriptions.......................................13
2.2
2.3
2.4
2.5
Dynamic Cache Sizing...........................................................................16
Enhanced Intel SpeedStep® Technology...................................................17
Enhanced Low-Power States ..................................................................18
FSB Low Power Enhancements ...............................................................19
2.5.1
Front Side Bus........................................................................19
3
Electrical Specifications....................................................................................20
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
Power and Ground Pins .........................................................................20
FSB Clock (BCLK [1:0]) and Processor Clocking ........................................20
Voltage Identification............................................................................20
Catastrophic Thermal Protection.............................................................23
Reserved and Unused Pins.....................................................................23
FSB Frequency Select Signals (BSEL [2:0])..............................................23
FSB Signal Groups................................................................................24
CMOS Asynchronous Signals..................................................................25
Maximum Ratings.................................................................................25
Processor DC Specifications ...................................................................26
4
5
Package Mechanical Specifications and Pin Information.........................................33
4.1
Package Mechanical Specifications ..........................................................33
4.1.1 Package Mechanical Drawings ...................................................34
4.2
4.3
Processor Pin-out Assignment ................................................................34
Signal Description ................................................................................41
Thermal Specifications and Design Considerations ...............................................50
5.1
5.2
5.3
Thermal Diode .....................................................................................51
Intel® Thermal Monitor.........................................................................53
Digital Thermal Sensor..........................................................................55
5.3.1
5.3.2
Out of Specification Detection ...................................................56
PROCHOT# Signal Pin..............................................................56
Datasheet
3
INTEL [ INTEL ]
