Chapter 1: Introduction
Features
1–3
MAX II devices are available in space-saving FineLine BGA, Micro FineLine BGA,
and thin quad flat pack (TQFP) packages (refer to
and
MAX II
devices support vertical migration within the same package (for example, you can
migrate between the EPM570, EPM1270, and EPM2210 devices in the 256-pin
FineLine BGA package). Vertical migration means that you can migrate to devices
whose dedicated pins and JTAG pins are the same and power pins are subsets or
supersets for a given package across device densities. The largest density in any
package has the highest number of power pins; you must lay out for the largest
planned density in a package to provide the necessary power pins for migration. For
I/O pin migration across densities, cross reference the available I/O pins using the
device pin-outs for all planned densities of a given package type to identify which
I/O pins can be migrated. The Quartus
®
II software can automatically cross-reference
and place all pins for you when given a device migration list.
Table 1–3.
MAX II Packages and User I/O Pins
68-Pin
Micro
FineLine
BGA
—
—
—
—
54
—
100-Pin
Micro
FineLine
BGA
80
76
—
—
80
76
100-Pin
FineLine
BGA
80
76
—
—
—
—
144-Pin
Micro
FineLine
BGA
—
—
—
—
—
116
256-Pin
Micro
FineLine
BGA
—
160
212
—
—
160
256-Pin
FineLine
BGA
—
160
212
204
—
—
324-Pin
FineLine
BGA
—
—
—
272
—
—
Device
EPM240
EPM240G
EPM570
EPM570G
EPM1270
EPM1270G
EPM2210
EPM2210G
EPM240Z
EPM570Z
100-Pin
TQFP
80
76
—
—
—
—
144-Pin
TQFP
—
116
116
—
—
—
Note to
(1) Packages available in lead-free versions only.
Table 1–4.
MAX II TQFP, FineLine BGA, and Micro FineLine BGA Package Sizes
68-Pin
Micro
FineLine
BGA
0.5
25
5×5
100-Pin
Micro
FineLine
BGA
0.5
36
6×6
100-Pin
FineLine
BGA
1
121
11 × 11
144-Pin
Micro
FineLine
BGA
0.5
49
7×7
256-Pin
Micro
FineLine
BGA
0.5
121
11 × 11
256-Pin
FineLine
BGA
1
289
17 × 17
324-Pin
FineLine
BGA
1
361
19 × 19
Package
Pitch (mm)
Area (mm2)
Length × width
(mm × mm)
100-Pin
TQFP
0.5
256
16 × 16
144-Pin
TQFP
0.5
484
22 × 22