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80C188EC25 参数 Datasheet PDF下载

80C188EC25图片预览
型号: 80C188EC25
PDF下载: 下载PDF文件 查看货源
内容描述: 16位高集成嵌入式处理器 [16-BIT HIGH-INTEGRATION EMBEDDED PROCESSORS]
分类和应用:
文件页数/大小: 57 页 / 787 K
品牌: INTEL [ INTEL ]
 浏览型号80C188EC25的Datasheet PDF文件第20页浏览型号80C188EC25的Datasheet PDF文件第21页浏览型号80C188EC25的Datasheet PDF文件第22页浏览型号80C188EC25的Datasheet PDF文件第23页浏览型号80C188EC25的Datasheet PDF文件第25页浏览型号80C188EC25的Datasheet PDF文件第26页浏览型号80C188EC25的Datasheet PDF文件第27页浏览型号80C188EC25的Datasheet PDF文件第28页  
80C186EC/188EC, 80L186EC/188EC  
T
(the ambient temperature) can be calculated  
A
Package Thermal Specifications  
from i (thermal resistance from the case to ambi-  
CA  
ent) with the following equation:  
The 80C186EC/80L186EC is specified for operation  
when T (the case temperature) is within the range  
C
e
b
P * i  
T
T
C
b
a
A
CA  
of 40 C to 100 C. T may be measured in any  
C
§
§
environment to determine whether the processor is  
within the specified operating range. The case tem-  
perature must be measured at the center of the top  
surface.  
Typical values for i  
in Table 9. P (the maximum power consumptionÐ  
specified in Watts) is calculated by using the maxi-  
at various airflows are given  
CA  
mum I  
and V  
of 5.5V.  
CC  
CC  
Table 9. Thermal Resistance (i ) at Various Airflows (in C/Watt)  
§
CA  
Airflow in ft/min (m/sec)  
0
200  
400  
600  
800  
1000  
(0)  
(1.01)  
(2.03)  
(3.04)  
(4.06)  
(5.07)  
i
i
i
(PQFP)  
(QFP)  
27.0  
64.5  
62.0  
22.0  
55.5  
TBD  
18.0  
51.0  
TBD  
15.0  
TBD  
TBD  
14.0  
TBD  
TBD  
13.5  
TBD  
TBD  
CA  
CA  
CA  
(SQFP)  
24  
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