80960SB
EMBEDDED 32-BIT MICROPROCESSOR
WITH 16-BIT BURST DATA BUS
CONTENTS
PAGE
1.0 THE i960® PROCESSOR ...........................................................................................................................1
1.1 Key Performance Features .................................................................................................................2
1.1.1 Memory Space And Addressing Modes ...................................................................................4
1.1.2 Data Types ...............................................................................................................................4
1.1.3 Large Register Set ...................................................................................................................4
1.1.4 Multiple Register Sets ..............................................................................................................5
1.1.5 Instruction Cache .....................................................................................................................5
1.1.6 Register Scoreboarding ...........................................................................................................5
1.1.7 Floating-Point Arithmetic ..........................................................................................................6
1.1.8 High Bandwidth Bus ................................................................................................................6
1.1.9 Interrupt Handling ....................................................................................................................7
1.1.10 Debug Features .....................................................................................................................7
1.1.11 Fault Detection .......................................................................................................................7
1.1.12 Built-in Testability ...................................................................................................................7
1.1.13 CHMOS ..................................................................................................................................7
2.0 ELECTRICAL SPECIFICATIONS............................................................................................................. 11
2.1 Power and Grounding ....................................................................................................................... 11
2.2 Power Decoupling Recommendations .............................................................................................. 11
2.3 Connection Recommendations ......................................................................................................... 11
2.4 Characteristic Curves ....................................................................................................................... 11
2.5 Test Load Circuit ...............................................................................................................................13
2.6 ABSOLUTE MAXIMUM RATINGS* ..................................................................................................14
2.7 DC Characteristics ............................................................................................................................14
2.8 AC Specifications ..............................................................................................................................15
3.0 MECHANICAL DATA ...............................................................................................................................20
3.1 Packaging .........................................................................................................................................20
3.2 Pin Assignment .................................................................................................................................20
3.3 Pinout ................................................................................................................................................22
3.4 Package Thermal Specifications ......................................................................................................26
4.0 WAVEFORMS...........................................................................................................................................27
5.0 REVISION HISTORY ................................................................................................................................33
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INTEL [ INTEL ]
