Pentium
®
III Processor for the SC242 at 450 MHz to 733 MHz
4.0
Thermal Specifications and Design Considerations......................................................... 48
4.1
Thermal Specifications........................................................................................ 49
4.1.1 Thermal Diode........................................................................................ 51
S.E.C.C. Mechanical Specifications.................................................................... 52
S.E.C.C.2 Mechanical Specification.................................................................... 59
S.E.C.C.2 Structural Mechanical Specification ................................................... 65
Processor Package Materials Information .......................................................... 67
Intel
®
Pentium
®
III Processor Signal Listing........................................................ 67
Intel
®
Pentium
®
III Processor Core Pad to Substrate Via Assignments .............. 76
5.6.1 Processor Core Pad Via Assignments (CPUID 067xh).......................... 76
5.6.2 Processor Core Signal Assignments (CPUID 067xh) ............................ 76
5.6.3 Processor Core Pad Via Assignments (CPUID 068xh).......................... 89
Introduction ......................................................................................................... 90
Fan Heatsink Mechanical Specifications............................................................. 90
6.2.1 Boxed Processor Fan Heatsink Dimensions .......................................... 90
6.2.2 Boxed Processor Fan Heatsink Weight.................................................. 92
6.2.3 Boxed Processor Retention Mechanism ................................................ 92
Fan Heatsink Electrical Requirements ................................................................ 93
6.3.1 Fan Heatsink Power Supply ................................................................... 93
Fan Heatsink Thermal Specifications.................................................................. 94
6.4.1 Boxed Processor Cooling Requirements ............................................... 94
Alphabetical Signals Reference .......................................................................... 95
Signal Summaries ............................................................................................. 102
5.0
S.E.C.C. and S.E.C.C.2 Mechanical Specifications......................................................... 52
5.1
5.2
5.3
5.4
5.5
5.6
6.0
Boxed Processor Specifications....................................................................................... 90
6.1
6.2
6.3
6.4
7.0
Intel
®
Pentium
®
III Processor Signal Description ............................................................. 95
7.1
7.2
4
Datasheet
INTEL [ INTEL CORPORATION ]
