欢迎访问ic37.com |
会员登录 免费注册
发布采购

80502533EB256 参数 Datasheet PDF下载

80502533EB256图片预览
型号: 80502533EB256
PDF下载: 下载PDF文件 查看货源
内容描述: [Microprocessor, 32-Bit, 533MHz, CMOS, CPGA370, PGA-370]
分类和应用: 时钟外围集成电路
文件页数/大小: 76 页 / 564 K
品牌: INTEL [ INTEL CORPORATION ]
 浏览型号80502533EB256的Datasheet PDF文件第2页浏览型号80502533EB256的Datasheet PDF文件第3页浏览型号80502533EB256的Datasheet PDF文件第4页浏览型号80502533EB256的Datasheet PDF文件第5页浏览型号80502533EB256的Datasheet PDF文件第7页浏览型号80502533EB256的Datasheet PDF文件第8页浏览型号80502533EB256的Datasheet PDF文件第9页浏览型号80502533EB256的Datasheet PDF文件第10页  
Pentium
®
III Processor for the PGA370 Socket at 500 MHz to 866 MHz
List of Tables
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
Processor Identification......................................................................................... 9
Voltage Identification Definition .......................................................................... 18
System Bus Signal Groups ................................................................................ 20
Frequency Select Truth Table for BSEL[1:0] ...................................................... 21
Absolute Maximum Ratings ................................................................................ 22
Voltage and Current Specifications .................................................................... 23
AGTL+ Signal Groups DC Specifications ........................................................... 25
Non-AGTL+ Signal Group DC Specifications ..................................................... 25
Processor AGTL+ Bus Specifications ................................................................ 26
System Bus AC Specifications (Clock) ............................................................... 27
Valid System Bus to Core Frequency Ratios ..................................................... 28
System Bus AC Specifications (AGTL+ Signal Group) ....................................... 28
System Bus AC Specifications (CMOS Signal Group)........................................ 29
System Bus AC Specifications (Reset Conditions) ............................................ 29
System Bus AC Specifications (APIC Clock and APIC I/O) ................................ 29
System Bus AC Specifications (TAP Connection) .............................................. 30
BCLK/PICCLK Signal Quality Specifications for Simulation at the
Processor Pins ................................................................................................... 34
AGTL+ Signal Groups Ringback Tolerance Specifications at the
Processor Pins .................................................................................................... 35
Example Platform Information............................................................................. 38
100 MHz AGTL+ Signal Group Overshoot/Undershoot Tolerance at
Processor Pins .................................................................................................... 39
133 MHz AGTL+ Signal Group Overshoot/Undershoot Tolerance .................... 40
33 MHz CMOS Signal Group Overshoot/Undershoot Tolerance at
Processor Pins .................................................................................................... 40
Signal Ringback Specifications for Non-AGTL+ Signal Simulation at the
Processor Pins ................................................................................................... 42
Intel
®
Pentium
®
III Processor for the PGA370 Socket Thermal Design Power .. 43
Thermal Diode Parameters ................................................................................. 45
Thermal Diode Interface...................................................................................... 45
Intel
®
Pentium
®
III Processor Package Dimensions ........................................... 47
Processor Die Loading Parameters .................................................................... 47
Signal Listing in Order by Signal Name .............................................................. 50
Signal Listing in Order by Pin Number ................................................................ 55
Boxed Processor Fan Heatsink Spatial Dimensions........................................... 61
Fan Heatsink Power and Signal Specifications................................................... 63
Signal Description ............................................................................................... 66
Output Signals..................................................................................................... 73
Input Signals ....................................................................................................... 74
Input/Output Signals (Single Driver).................................................................... 75
Input/Output Signals (Multiple Driver) ................................................................. 75
6
Datasheet