Pentium
®
III Processor for the PGA370 Socket at 500 MHz to 866 MHz
3.4
Non-AGTL+ Signal Quality Specifications and Measurement Guidelines........... 41
3.4.1 Overshoot/Undershoot Guidelines ......................................................... 42
3.4.2 Ringback Specification........................................................................... 42
3.4.3 Settling Limit Guideline .......................................................................... 42
Thermal Specifications........................................................................................ 43
4.1.1 Thermal Diode........................................................................................ 44
FC-PGA Mechanical Specifications .................................................................... 46
Processor Markings ............................................................................................ 48
Processor Signal Listing...................................................................................... 48
Mechanical Specifications................................................................................... 60
6.1.1 Boxed Processor Thermal Cooling Solution Dimensions....................... 60
6.1.2 Boxed Processor Heatsink Weight......................................................... 62
6.1.3 Boxed Processor Thermal Cooling Solution Clip ................................... 62
6.1.4 Heatsink Grounding for the Boxed Processor ........................................ 63
Boxed Processor Requirements ......................................................................... 63
6.2.1 Fan Heatsink Power Supply ................................................................... 63
Thermal Specifications........................................................................................ 64
6.3.1 Boxed Processor Cooling Requirements ............................................... 64
Alphabetical Signals Reference .......................................................................... 66
Signal Summaries ............................................................................................... 73
4.0
Thermal Specifications and Design Considerations......................................................... 43
4.1
5.0
Mechanical Specifications............................................................................................... 46
5.1
5.2
5.3
6.0
Boxed Processor Specifications....................................................................................... 60
6.1
6.2
6.3
7.0
Processor Signal Description ........................................................................................... 66
7.1
7.2
4
Datasheet
INTEL [ INTEL CORPORATION ]
