欢迎访问ic37.com |
会员登录 免费注册
发布采购

631 参数 Datasheet PDF下载

631图片预览
型号: 631
PDF下载: 下载PDF文件 查看货源
内容描述: 英特尔奔腾4处理器 [Intel Pentium 4 Processor]
分类和应用:
文件页数/大小: 106 页 / 3572 K
品牌: INTEL [ INTEL ]
 浏览型号631的Datasheet PDF文件第72页浏览型号631的Datasheet PDF文件第73页浏览型号631的Datasheet PDF文件第74页浏览型号631的Datasheet PDF文件第75页浏览型号631的Datasheet PDF文件第77页浏览型号631的Datasheet PDF文件第78页浏览型号631的Datasheet PDF文件第79页浏览型号631的Datasheet PDF文件第80页  
Thermal Specifications and Design Considerations  
The case temperature is defined at the geometric top center of the processor. Analysis  
indicates that real applications are unlikely to cause the processor to consume  
maximum power dissipation for sustained time periods. Intel recommends that  
complete thermal solution designs target the Thermal Design Power (TDP) indicated in  
Table 26 instead of the maximum processor power consumption. The Thermal Monitor  
feature is designed to protect the processor in the unlikely event that an application  
exceeds the TDP recommendation for a sustained periods of time. For more details on  
the usage of this feature, refer to Section 5.2. In all cases the Thermal Monitor or  
Thermal Monitor 2 feature must be enabled for the processor to remain within  
specification.  
Table 26.  
Processor Thermal Specifications for 775_VR_CONFIG_05A Processors  
Core  
Frequency  
(GHz)  
Thermal  
Design  
Power (W)  
Processor  
Number  
Minimum  
Maximum TC (°C)  
Notes  
T
C (°C)  
See Table 28 and  
Figure 12  
1, 2  
631  
641  
651  
3 GHz  
86  
86  
86  
86  
5
5
5
5
See Table 28 and  
Figure 12  
3.20 GHz  
3.40 GHz  
3.60 GHz  
1, 2  
1, 2  
1, 2  
See Table 28 and  
Figure 12  
See Table 28 and  
Figure 12  
661  
NOTES:  
1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the  
maximum power that the processor can dissipate.  
2. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP.  
Therefore, the maximum T will vary depending on the TDP of the individual processor. Refer to Table 28 and  
C
Figure 12 for the allowed combinations of power and T .  
C
Table 27.  
Processor Thermal Specifications for 775_VR_CONFIG_06 Processors  
Core  
Frequency  
(GHz)  
Thermal  
Design  
Power (W)  
Processor  
Number  
Minimum  
Maximum TC (°C)  
Notes  
T
C (°C)  
631  
641  
651  
3 GHz  
65  
65  
65  
5
5
5
See Table 29and  
Figure 13  
1, 2  
3.20 GHz  
3.40 GHz  
NOTES:  
1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the  
maximum power that the processor can dissipate.  
2. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP.  
Therefore, the maximum T will vary depending on the TDP of the individual processor. Refer to thermal profile  
C
figure and associated table for the allowed combinations of power and T .  
C
76  
Datasheet  
 复制成功!