Boxed Processor Specifications
Figure 22.
Baseboard Power Header Placement Relative to Processor Socket
R110
[4.33]
B
C
7.3
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution used by the
boxed processor.
7.3.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the
processor's temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
temperature specification is in Chapter 5. The boxed processor fan heatsink is able to
keep the processor temperature within the specifications in chassis that provide good
thermal management. For the boxed processor fan heatsink to operate properly, it is
critical that the airflow provided to the fan heatsink is unimpeded. Airflow of the fan
heatsink is into the center and out of the sides of the fan heatsink. Airspace is required
around the fan to ensure that the airflow through the fan heatsink is not blocked.
Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases
fan life. Figure 23 and Figure 24 illustrate an acceptable airspace clearance for the fan
heatsink. The air temperature entering the fan should be kept below 38 °C. A
Thermally Advantaged Chassis with an Air Guide 1.1 is recommended to meet the
38 °C requirement. Again, meeting the processor's temperature specification is the
responsibility of the system integrator.
Note:
The processor fan is the primary source of airflow for cooling the VCC voltage regulator.
Dedicated voltage regulator cooling components may be necessary if the selected fan is
not capable of keeping regulator components below maximum rated temperatures.
Datasheet
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INTEL [ INTEL ]
