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631XESB 参数 Datasheet PDF下载

631XESB图片预览
型号: 631XESB
PDF下载: 下载PDF文件 查看货源
内容描述: [Multifunction Peripheral, CMOS, PBGA641, 40 X 40 MM, MICRO, BGA-641]
分类和应用:
文件页数/大小: 106 页 / 3572 K
品牌: INTEL [ INTEL ]
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Boxed Processor Specifications  
The power header on the baseboard must be positioned to allow the fan heatsink power  
cable to reach it. The power header identification and location should be documented in  
the platform documentation, or on the system board itself. Figure 22 shows the  
location of the fan power connector relative to the processor socket. The baseboard  
power header should be positioned within 4.33 inches from the center of the processor  
socket.  
Figure 21.  
Boxed Processor Fan Heatsink Power Cable Connector Description  
Signal  
Pin  
Straight square pin, 4-pin terminal housing with  
polarizing ribs and friction locking ramp.  
1
2
3
4
GND  
+12 V  
0.100" pitch, 0.025" square pin width.  
SENSE  
CONTROL  
Match with straight pin, friction lock header on  
mainboard.  
3 4  
1 2  
Table 35.  
Fan Heatsink Power and Signal Specifications  
Description  
Min  
Typ  
Max  
Unit  
Notes  
+12 V: 12 volt fan power supply  
10.2  
12  
13.8  
V
IC:  
Peak Fan current draw  
Fan start-up current draw  
Fan start-up current draw maximum duration  
1.1  
1.5  
2.2  
1.0  
A
A
Second  
pulses per  
fan  
1
SENSE: SENSE frequency  
2
revolution  
2,3  
CONTROL  
21  
25  
28  
kHz  
NOTES:  
1. Baseboard should pull this pin up to 5 V with a resistor.  
2. Open Drain Type, Pulse Width Modulated.  
3. Fan will have a pull-up resistor to 4.75 V, maximum 5.25 V.  
92  
Datasheet