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631XESB 参数 Datasheet PDF下载

631XESB图片预览
型号: 631XESB
PDF下载: 下载PDF文件 查看货源
内容描述: [Multifunction Peripheral, CMOS, PBGA641, 40 X 40 MM, MICRO, BGA-641]
分类和应用:
文件页数/大小: 106 页 / 3572 K
品牌: INTEL [ INTEL ]
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Thermal Specifications and Design Considerations  
5.1.2  
Thermal Metrology  
The maximum and minimum case temperatures (TC) for the processor is specified in  
Table 26. This temperature specification is meant to help ensure proper operation of  
the processor. Figure 14 illustrates where Intel recommends TC thermal measurements  
should be made. For detailed guidelines on temperature measurement methodology,  
refer to the appropriate processor Thermal and Mechanical Design Guidelines (see  
Section 1.2).  
Figure 14.  
Case Temperature (TC) Measurement Location  
Measure TC at this point  
(geometric center of the package)  
37.5 mm  
5.2  
Processor Thermal Features  
5.2.1  
Thermal Monitor  
The Thermal Monitor feature helps control the processor temperature by activating the  
thermal control circuit (TCC) when the processor silicon reaches its maximum operating  
temperature. The TCC reduces processor power consumption by modulating (starting  
and stopping) the internal processor core clocks. The Thermal Monitor feature must  
be enabled for the processor to be operating within specifications. The  
temperature at which Thermal Monitor activates the thermal control circuit is not user  
configurable and is not software visible. Bus traffic is snooped in the normal manner,  
and interrupt requests are latched (and serviced during the time that the clocks are on)  
while the TCC is active.  
When the Thermal Monitor feature is enabled and a high temperature situation exists  
(i.e., TCC is active), the clocks will be modulated by alternately turning the clocks off  
and on at a duty cycle specific to the processor (typically 30–50%). Clocks often will  
not be off for more than 3.0 microseconds when the TCC is active. Cycle times are  
processor speed dependent and decrease as processor core frequencies increase. A  
small amount of hysteresis has been included to prevent rapid active/inactive  
transitions of the TCC when the processor temperature is near its maximum operating  
temperature. Once the temperature has dropped below the maximum operating  
temperature and the hysteresis timer has expired, the TCC goes inactive and clock  
modulation ceases.  
Datasheet  
79