Electrical Specifications
Table 4.
Voltage and Current Specification
Symbol
Parameter
Min
Typ
Max
Unit Notes1, 2
VTT_OUT_LEFT
and
VTT_OUT_RIGHT
ICC
DC Current that may be drawn from
VTT_OUT_LEFT and VTT_OUT_RIGHT per
pin
—
—
580
mA
15, 16
ITT
Steady-state FSB termination current
Power-up FSB termination current
ICC for PLL lands
—
—
—
—
—
—
—
—
—
—
3.5
4.5
35
A
15, 17
ITT_POWER-UP
ICC_VCCA
ICC_VCCIOPLL
ICC_GTLREF
NOTES:
A
mA
mA
µA
ICC for I/O PLL land
26
ICC for GTLREF
200
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. Adherence to the voltage specifications for the processor are required to ensure reliable processor operation.
3. Each processor is programmed with a maximum valid voltage identification value (VID) that is set at manufacturing and can
not be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same
frequency may have different settings within the VID range. Note that this differs from the VID employed by the processor
during a power management event (Thermal Monitor 2, Enhanced Intel SpeedStep technology, or Enhanced HALT State).
4. These voltages are targets only. A variable voltage source should exist on systems in the event that a different
voltage is required. See Section 2.3 and Table 2 for more information.
5. The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE lands at the socket with a 100 MHz
bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground
wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
6. Refer to Table 5 and Figure 1 for the minimum, typical, and maximum VCC allowed for a given current. The
processor should not be subjected to any VCC and ICC combination wherein VCC exceeds VCC_MAX for a given
current.
7. I
is specified at V
.
CC_MAX
CC_MAX
8. The current specified is also for AutoHALT State.
9. I Stop-Grant is specified at V
.
CC_MAX
CC
10.I
and I
are specified at V
and TC = 50 °C.
SGNT
ENHANCED_AUTO_HALT
CC_TYP
11.These parameters are based on design characterization and are not tested.
12.The maximum instantaneous current the processor will draw while the thermal control circuit is active (as indicated by the
assertion of PROCHOT#) is the same as the maximum I for the processor.
CC
13.V must be provided via a separate voltage source and not be connected to V . This specification is measured at the land.
TT
CC
14.Baseboard bandwidth is limited to 20 MHz.
15.This is maximum total current drawn from VTT plane by only the processor. This specification does not include
the current coming from RTT (through the signal line). Refer to the Voltage Regulator-Down (VRD) 10.1 Design Guide
For Desktop and Transportable LGA775 Socket to determine the total ITT drawn by the system.
16.This is a steady-state I current specification, which is applicable when both V and V are high.
TT
TT
CC
17.This is a power-up peak current specification that is applicable when V is high and V is low.
TT
CC
Datasheet
19
INTEL [ INTEL ]
