1–4
Chapter 1: MAX V Device Family Overview
Ordering Information
Ordering Information
Figure 1–1 shows the ordering codes for MAX V devices.
Figure 1–1. MAX V Device Packaging Ordering Information
5M
40Z
E
64
C
4
N
Family Signature
Optional Suffix
5M: MAX V
Indicates specific device
options or shipment method
N: Lead-free packaging
Device Type
Speed Grade
40Z: 40 Logic Elements
80Z: 80 Logic Elements
160Z: 160 Logic Elements
240Z: 240 Logic Elements
570Z: 570 Logic Elements
4 or 5, with 4 being the fastest
1270Z: 1,270 Logic Elements
2210Z: 2,210 Logic Elements
Operating Temperature
C: Commercial temperature (TJ = 0
°
C to 85
C to 100
A: Automotive temperature (TJ = -40
°
C)
C)
I: Industrial temperature (TJ = -40
°
°
°
C to 125
°
C)
Package Type
Pin Count
Number of pins for a particular package
T: Thin quad flat pack (TQFP)
F: FineLine BGA (FBGA)
M: Micro FineLine BGA (MBGA)
E: Plastic Enhanced Quad Flat Pack (EQFP)
Document Revision History
Table 1–4 lists the revision history for this chapter.
Table 1–4. Document Revision History
Date
May 2011
Version
Changes
■ Updated Figure 1–1.
■ Updated Table 1–3.
1.2
January 2011
1.1
1.0
Updated “Feature Summary” section.
Initial release.
December 2010
MAX V Device Handbook
May 2011 Altera Corporation
INTEL [ INTEL ]
