571 参数 Datasheet PDF下载

型号：	571
PDF下载：	下载PDF文件查看货源
内容描述：	奔腾4处理器，支持超线程技术 [Pentium 4 Processors Supporting Hyper-Threading Technology]
分类和应用：
文件页数/大小：	96 页 / 1585 K
品牌：	INTEL [ INTEL CORPORATION ]

Contents

Introduction.................................................................................................................................... 11

Terminology ........................................................................................................................ 12

1.1.1 Processor Packaging Terminology ........................................................................ 12

References ......................................................................................................................... 13

FSB and GTLREF............................................................................................................... 15

Power and Ground Lands................................................................................................... 15

Decoupling Guidelines........................................................................................................ 15

2.3.1 VCC Decoupling .................................................................................................... 16

2.3.2 FSB GTL+ Decoupling........................................................................................... 16

2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking ................................................... 16

Voltage Identification .......................................................................................................... 17

2.4.1 Phase Lock Loop (PLL) Power and Filter .............................................................. 19

Reserved, Unused, FC and TESTHI Signals...................................................................... 20

FSB Signal Groups ............................................................................................................. 21

GTL+ Asynchronous Signals ..............................................................................................22

Test Access Port (TAP) Connection ................................................................................... 23

FSB Frequency Select Signals (BSEL[2:0]) ....................................................................... 23

Absolute Maximum and Minimum Ratings ......................................................................... 24

Processor DC Specifications ..............................................................................................24

VCC Overshoot Specification ............................................................................................. 33

2.12.1 Die Voltage Validation ........................................................................................... 33

GTL+ FSB Specifications....................................................................................................34

Package Mechanical Drawing ............................................................................................ 35

Processor Component Keep-Out Zones............................................................................. 39

Package Loading Specifications......................................................................................... 39

Package Handling Guidelines............................................................................................. 39

Package Insertion Specifications........................................................................................ 40

Processor Mass Specification............................................................................................. 40

Processor Materials ............................................................................................................ 40

Processor Markings ............................................................................................................ 40

Processor Land Coordinates ..............................................................................................41

Processor Land Assignments ............................................................................................. 43

Alphabetical Signals Reference .......................................................................................... 66

Processor Thermal Specifications ...................................................................................... 75

5.1.1 Thermal Specifications .......................................................................................... 75

5.1.2 Thermal Metrology ................................................................................................. 79

Processor Thermal Features ..............................................................................................79

5.2.1 Thermal Monitor..................................................................................................... 79

5.2.2 Thermal Monitor 2.................................................................................................. 80

Electrical Specifications ................................................................................................................. 15

Package Mechanical Specifications ..............................................................................................35

Land Listing and Signal Descriptions ............................................................................................ 43

Thermal Specifications and Design Considerations ...................................................................... 75

5.2

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