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550 参数 Datasheet PDF下载

550图片预览
型号: 550
PDF下载: 下载PDF文件 查看货源
内容描述: 奔腾4处理器,支持超线程技术 [Pentium 4 Processors Supporting Hyper-Threading Technology]
分类和应用:
文件页数/大小: 96 页 / 1585 K
品牌: INTEL [ INTEL ]
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Boxed Processor Specifications  
Figure 7-6. Baseboard Power Header Placement Relative to Processor Socket  
R4.33  
[110]  
B
C
7.3  
Thermal Specifications  
This section describes the cooling requirements of the fan heatsink solution used by the boxed  
processor.  
7.3.1  
Boxed Processor Cooling Requirements  
The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's  
temperature specification is also a function of the thermal design of the entire system, and  
ultimately the responsibility of the system integrator. The processor temperature specification is in  
Chapter 5. The boxed processor fan heatsink is able to keep the processor temperature within the  
specifications (see Table 5-1) in chassis that provide good thermal management. For the boxed  
processor fan heatsink to operate properly, it is critical that the airflow provided to the fan heatsink  
is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.  
Airspace is required around the fan to ensure that the airflow through the fan heatsink is not  
blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases fan  
life. Figure 7-7 and Figure 7-8 illustrate an acceptable airspace clearance for the fan heatsink. The  
air temperature entering the fan should be kept below 38 ºC. Again, meeting the processor's  
temperature specification is the responsibility of the system integrator.  
Datasheet  
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