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550 参数 Datasheet PDF下载

550图片预览
型号: 550
PDF下载: 下载PDF文件 查看货源
内容描述: 奔腾4处理器,支持超线程技术 [Pentium 4 Processors Supporting Hyper-Threading Technology]
分类和应用:
文件页数/大小: 96 页 / 1585 K
品牌: INTEL [ INTEL ]
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Boxed Processor Specifications  
7 Boxed Processor Specifications  
The Pentium 4 processor on 90 nm process in the 775-land package will also be offered as a boxed  
Intel processor. Boxed Intel processors are intended for system integrators who build systems from  
baseboards and standard components. The boxed Pentium 4 processor in the 775-land package will  
be supplied with a cooling solution. This chapter documents baseboard and system requirements  
for the cooling solution that will be supplied with the boxed Pentium 4 processor in the 775-land  
package. This chapter is particularly important for OEMs that manufacture baseboards for system  
integrators. Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and  
inches [in brackets]. Figure 7-1 shows a mechanical representation of a boxed Pentium 4 processor  
in the 775-land package.  
Note: Drawings in this section reflect only the specifications on the boxed Intel processor product. These  
dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system  
designers’ responsibility to consider their proprietary cooling solution when designing to the  
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required keep-out zone on their system platforms and chassis. Refer to the Intel Pentium 4  
Processor on 90 nm Process in the 775-Land Package Thermal Design Guidelines for further  
guidance. Contact your local Intel Sales Representative for this document.  
Figure 7-1. Mechanical Representation of the Boxed Processor  
NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.  
Datasheet  
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