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550 参数 Datasheet PDF下载

550图片预览
型号: 550
PDF下载: 下载PDF文件 查看货源
内容描述: 奔腾4处理器,支持超线程技术 [Pentium 4 Processors Supporting Hyper-Threading Technology]
分类和应用:
文件页数/大小: 96 页 / 1585 K
品牌: INTEL [ INTEL ]
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Contents  
Figures  
2-1 Phase Lock Loop (PLL) Filter Requirements..............................................................................19  
2-2 VCC Static and Transient Tolerance for 775_VR_CONFIG_04A...............................................28  
2-3 VCC Static and Transient Tolerance for 775_VR_CONFIG_04B...............................................30  
2-4 VCC Overshoot Example Waveform ..........................................................................................33  
3-1 Processor Package Assembly Sketch........................................................................................35  
3-2 Processor Package Drawing 1 ...................................................................................................36  
3-3 Processor Package Drawing 2 ...................................................................................................37  
3-4 Processor Package Drawing 3 ...................................................................................................38  
3-5 Processor Top-Side Marking Example .......................................................................................40  
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3-6 Processor Top-Side Marking Example for Processors Supporting Intel EM64T......................41  
3-7 Processor Land Coordinates (Top View)....................................................................................42  
4-1 Landout Diagram (Top View – Left Side)....................................................................................44  
4-2 Landout Diagram (Top View – Right Side) .................................................................................45  
5-1 Thermal Profile for Processors with PRB = 1 .............................................................................77  
5-2 Thermal Profile for Processors with PRB = 0 .............................................................................78  
5-3 Case Temperature (TC) Measurement Location........................................................................79  
5-4 Thermal Monitor 2 Frequency and Voltage Ordering .................................................................81  
6-1 Processor Low Power State Machine.........................................................................................87  
7-1 Mechanical Representation of the Boxed Processor..................................................................89  
7-2 Space Requirements for the Boxed Processor (Side View) .......................................................90  
7-3 Space Requirements for the Boxed Processor (Top View) ........................................................90  
7-4 Space Requirements for the Boxed Processor (Overall View)...................................................91  
7-5 Boxed Processor Fan Heatsink Power Cable Connector Description........................................92  
7-6 Baseboard Power Header Placement Relative to Processor Socket .........................................93  
7-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Top View)...........................94  
7-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side View)..........................94  
7-9 Boxed Processor Fan Heatsink Set Points.................................................................................95  
Datasheet  
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