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550 参数 Datasheet PDF下载

550图片预览
型号: 550
PDF下载: 下载PDF文件 查看货源
内容描述: 奔腾4处理器,支持超线程技术 [Pentium 4 Processors Supporting Hyper-Threading Technology]
分类和应用:
文件页数/大小: 96 页 / 1585 K
品牌: INTEL [ INTEL ]
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Package Mechanical Specifications  
3 Package Mechanical  
Specifications  
The Pentium 4 processor in the 775-land package is packaged in a Flip-Chip Land Grid Array  
(FC-LGA4) package that interfaces with the motherboard via an LGA775 socket. The package  
consists of a processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS)  
is attached to the package substrate and core and serves as the mating surface for processor  
component thermal solutions, such as a heatsink. Figure 3-1 shows a sketch of the processor  
package components and how they are assembled together. Refer to the LGA775 Socket  
Mechanical Design Guide for complete details on the LGA775 socket.  
The package components shown in Figure 3-1 include the following:  
Integrated Heat Spreader (IHS)  
Thermal Interface Material (TIM)  
Processor core (die)  
Package substrate  
Capacitors  
Figure 3-1. Processor Package Assembly Sketch  
TIM  
Core (die)  
IHS  
Substrate  
Capacitors  
LGA775 Socket  
System Board  
NOTE:  
1. Socket and motherboard are included for reference and are not part of processor package.  
3.1  
Package Mechanical Drawing  
The package mechanical drawings are shown in Figure 3-2 and Figure 3-4. The drawings include  
dimensions necessary to design a thermal solution for the processor. These dimensions include:  
Package reference with tolerances (total height, length, width, etc.)  
IHS parallelism and tilt  
Land dimensions  
Top-side and back-side component keep-out dimensions  
Reference datums  
All drawing dimensions are in mm [in].  
Note: Guidelines on potential IHS flatness variation with socket load plate actuation and installation of  
the cooling solution is available in the processor Thermal/Mechanical Design Guidelines.  
Datasheet  
35  
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