Boxed Processor Specifications
Figure 7-6. Baseboard Power Header Placement Relative to Processor Socket
R4.33
[110]
B
C
7.3
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution used by the boxed
processor.
7.3.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's
temperature specification is also a function of the thermal design of the entire system, and
ultimately the responsibility of the system integrator. The processor temperature specification is in
Chapter 5. The boxed processor fan heatsink is able to keep the processor temperature within the
specifications (see Table 5-1) in chassis that provide good thermal management. For the boxed
processor fan heatsink to operate properly, it is critical that the airflow provided to the fan heatsink
is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.
Airspace is required around the fan to ensure that the airflow through the fan heatsink is not
blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases fan
life. Figure 7-7 and Figure 7-8 illustrate an acceptable airspace clearance for the fan heatsink. The
air temperature entering the fan should be kept below 38 ºC. Again, meeting the processor's
temperature specification is the responsibility of the system integrator.
Datasheet
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INTEL [ INTEL ]
