Boxed Processor Specifications
7.1
Mechanical Specifications
7.1.1
Boxed Processor Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed Pentium 4 processor on 90 nm
process in the 775-land package. The boxed processor will be shipped with an unattached fan
heatsink. Figure 7-1 shows a mechanical representation of the boxed Pentium 4 processor in the
775-land package.
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The
physical space requirements and dimensions for the boxed processor with assembled fan heatsink
are shown in Figure 7-2 (side view), and Figure 7-3 (top view). The airspace requirements for the
boxed processor fan heatsink must also be incorporated into new baseboard and system designs.
Airspace requirements are shown in Figure 7-7 and Figure 7-8. Note that some figures have
centerlines shown (marked with alphabetic designations) to clarify relative dimensioning.
Figure 7-2. Space Requirements for the Boxed Processor (Side View)
3.74
[95.0]
3.2
[81.3]
0.98
0.39
[25.0]
[10.0]
Figure 7-3. Space Requirements for the Boxed Processor (Top View)
3.74
[95.0]
3.74
[95.0]
NOTES:
1. Diagram does not show the attached hardware for the clip design and is provided only as a mechanical
representation.
90
Datasheet
INTEL [ INTEL ]
