Thermal Specifications and Design Considerations
Table 17.
Power Specifications for the Celeron M Processor (Sheet 2 of 2)
Deep Sleep Power at:
390
380
370
360J
360
350J
350
383
373
353
VCC2
8.8
8.8
8.8
8.8
8.8
8.8
8.8
1.4
1.4
1.4
100
VCC2
VCC2
VCC2
At 35°C,
Note 2,5,6
PDSLP
1.260 V
W
VCC2
1.260 V
VCC3
VCC3
0.940 V
TJ
Junction Temperature
0
°C
Notes 3, 4
NOTES:
1.
2.
3.
4.
5.
The Thermal Design Power (TDP) specification should be used to design the processor thermal solution.
The TDP is not the maximum theoretical power the processor can dissipate.
Not 100% tested. These power specifications are determined by characterization of the processor currents
at higher temperatures and extrapolating the values for the temperature indicated.
As measured by the on-die Intel Thermal Monitor. The Intel Thermal Monitor’s automatic mode is used to
indicate that the maximum TJ has been reached. Refer to Section 5.1 for more details.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within
specifications.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features
within each processor family, not across different processor families. See www.intel.com/products/
processor_number for details.
6.
See Table 4 for VCC2 and VCC3.
5.1
Thermal Specifications
5.1.1
Thermal Diode
The Celeron M processor incorporates two methods of monitoring die temperature, the
Intel Thermal Monitor and the thermal diode. The Intel Thermal Monitor (detailed in
Section 5.1) must be used to determine when the maximum specified processor
junction temperature has been reached. The second method, the thermal diode, can be
read by an off-die analog/digital converter (a thermal sensor) located on the
motherboard, or a stand-alone measurement kit. The thermal diode may be used to
monitor the die temperature of the processor for thermal management or
instrumentation purposes but cannot be used to indicate that the maximum TJ of the
processor has been reached. When using the thermal diode, a temperature offset value
must be read from a processor Model Specific register (MSR) and applied. See
Section 5.1.2 for more details. Please see Section 5.1.3 for thermal diode usage
recommendation when the PROCHOT# signal is not asserted. Table 18 and Table 19
provide the diode interface and specifications.
Note:
The reading of the external thermal sensor (on the motherboard) connected to the
processor thermal diode signals, will not necessarily reflect the temperature of the
hottest location on the die. This is due to inaccuracies in the external thermal sensor,
on-die temperature gradients between the location of the thermal diode and the hottest
location on the die, and time based variations in the die temperature measurement.
Time based variations can occur when the sampling rate of the thermal diode (by the
thermal sensor) is slower than the rate at which the TJ temperature can change.
Datasheet
65
INTEL [ INTEL ]
