Thermal Specifications and Design Considerations
5
Thermal Specifications and
Design Considerations
The Celeron M processor requires a thermal solution to maintain temperatures within
operating limits as set forth in Table 17. Any attempt to operate that processor outside
these operating limits may result in permanent damage to the processor and
potentially other components in the system. As processor technology changes, thermal
management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation. A complete thermal solution includes both component and system level
thermal management features. Component level thermal solutions include active or
passive heatsinks or heat exchangers attached to the processor exposed die. The
solution should make firm contact to the die while maintaining processor mechanical
specifications such as pressure. A typical system level thermal solution may consist of a
processor fan ducted to a heat exchanger that is thermally coupled to the processor via
a heat pipe or direct die attachment. A secondary fan, or air from the processor fan,
may also be used to cool other platform components or lower the internal ambient
temperature within the system.
To allow for the optimal operation and long-term reliability of Intel processor-based
systems, the system/processor thermal solution should be designed such that the
processor must remain within the minimum and maximum junction temperature (Tj)
specifications at the corresponding thermal design power (TDP) value listed in Table 17.
Thermal solutions not design to provide this level of thermal capability may affect the
long-term reliability of the processor and system.
The maximum junction temperature is defined by an activation of the processor Intel®
Thermal Monitor. Refer to Section 5.1.3 for more details. Analysis indicates that real
applications are unlikely to cause the processor to consume the theoretical maximum
power dissipation for sustained time periods. Intel recommends that complete thermal
solution designs target the TDP indicated in Table 17. The Intel Thermal Monitor feature
is designed to help protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained period of time. For more details on
the usage of this feature, refer to Section 5.1.3. In all cases, the Intel Thermal Monitor
feature must be enabled for the processor to remain within specification.
Datasheet
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INTEL [ INTEL ]
