Boxed Processor Specifications
Figure 7-5. Baseboard Power Header Placement Relative to Processor Socket
7.3
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution used by the boxed
processor.
7.3.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's
temperature specification is also a function of the thermal design of the entire system, and
ultimately the responsibility of the system integrator. The processor temperature specification is
found in Chapter 5 of this document. The boxed processor fan heatsink is able to keep the
processor temperature within the specifications (see Table 5-1) in chassis that provide good
thermal management. For the boxed processor fan heatsink to operate properly, it is critical that the
airflow provided to the fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and
out of the sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow
through the fan heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the
cooling efficiency and decreases fan life. Figure 7-6 and Figure 7-7 illustrate an acceptable
airspace clearance for the fan heatsink. The air temperature entering the fan is required to be at or
below 38 °C. Again, meeting the processor's temperature specification is the responsibility of the
system integrator.
Datasheet
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INTEL [ INTEL ]
