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330 参数 Datasheet PDF下载

330图片预览
型号: 330
PDF下载: 下载PDF文件 查看货源
内容描述: 赛扬D处理器 [Celeron D Processor]
分类和应用:
文件页数/大小: 82 页 / 1743 K
品牌: INTEL [ INTEL ]
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Boxed Processor Specifications  
7.1  
Mechanical Specifications  
7.1.1  
Boxed Processor Cooling Solution Dimensions  
This section documents the mechanical specifications of the boxed Celeron D processor. The  
boxed processor will be shipped with an unattached fan heatsink. Figure 7-1 shows a mechanical  
representation of the boxed Celeron D processor.  
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The  
physical space requirements and dimensions for the boxed processor with assembled fan heatsink  
are shown in Figure 7-2 (Side Views), and Figure 7-3 (Top View). The airspace requirements for  
the boxed processor fan heatsink must also be incorporated into new baseboard and system  
designs. Airspace requirements are shown in Figure 7-6 and Figure 7-7. Note that some figures  
have centerlines shown (marked with alphabetic designations) to clarify relative dimensioning.  
Figure 7-2. Requirements for the Boxed Processor (Side View)  
Figure 7-3. Space Requirements for the Boxed Processor (Top View)  
74  
Datasheet