Introduction
1.1.1
Processor Packaging Terminology
Commonly used terms are explained here for clarification:
• Intel® Celeron® D processor on 90 nm process and in the 478-pin package — Celeron D
processor in the FC-mPGA4 package with a 256-KB L2 cache.
• Processor — For this document, the term processor is the generic form of the Celeron D
processor.
• Keep-out zone — The area on or near the processor that system design can not use.
• Intel£ 865G/865GV/865PE/865P chipset — Chipset that supports DDR memory technology
for the Celeron D processor.
• Intel® 845G chipset — Chipset with embedded graphics that supports DDR memory
technology. Changes are required to support the Celeron D processor on 90 nm micron
process.
• Intel® 852 GME/PM/GMV chipsets — Intel’s Portability chipsets that support DDR
memory technology for the Celeron D processor
• Processor core — Processor core die with integrated L2 cache.
• FC-mPGA4 package — The Celeron D processor is available in a Flip-Chip Micro Pin Grid
Array 4 package, consisting of a processor core mounted on a pinned substrate with an
integrated heat spreader (IHS). This packaging technology employs a 1.27 mm [0.05 in] pitch
for the substrate pins.
• mPGA478B socket — The Celeron D processor mates with the system board through a
surface mount, 478-pin, zero insertion force (ZIF) socket.
• Integrated heat spreader (IHS) —A component of the processor package used to enhance
the thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
• Retention mechanism (RM)—Since the mPGA478B socket does not include any mechanical
features for heatsink attach, a retention mechanism is required. Component thermal solutions
should attach to the processor via a retention mechanism that is independent of the socket.
12
Datasheet
INTEL [ INTEL ]
