Thermal Specifications and Design Considerations
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table instead of the maximum processor power consumption. The Thermal Monitor
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to Section 5.2. To ensure maximum flexibility for future
requirements, systems should be designed to the 775_VR_CONFIG_06 guidelines, even
if a processor with a lower thermal dissipation is currently planned. In all cases the
Thermal Monitor or Thermal Monitor 2 feature must be enabled for the processor to
remain within specification.
Table 26.
Processor Thermal Specifications
Core
Frequency
(GHz)
Thermal
Design
Extended
HALT
775_VR_
CONFIG_06
Guidance2
Processor
Number
Minimum
TC (°C)
Maximum
TC (°C)
Notes
Power (W) Power (W)1
3,
4
420
430
1.6
1.8
2.0
2.2
35.0
35.0
35.0
35.0
8
8
8
8
5
5
5
5
3, 4
3, 4
3, 4
775_VR_CONFIG
_06
SeeTable 27,
Figure 16
440
450
NOTES:
1. Specification is at 35 °C T and typical voltage loadline.
C
2. 775_VR_CONFIG_06 guidelines provide a design target for meeting future thermal requirements.
3. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power
that the processor can dissipate.
4. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the
maximum T will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for
C
the allowed combinations of power and T .
C
76
Datasheet
INTEL [ INTEL ]
