Package Mechanical Specifications
3.5
3.6
Package Insertion Specifications
The processor can be inserted into and removed from a LGA775 socket 15 times. The
socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
Processor Mass Specification
The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all
the components that are included in the package.
3.7
Processor Materials
Table 22 lists some of the package components and associated materials.
Table 22.
Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Substrate
Nickel Plated Copper
Fiber Reinforced Resin
Gold Plated Copper
Substrate Lands
3.8
Processor Markings
Figure 12 shows the topside markings on the processor. This diagram is to aid in the
identification of the processor.
Figure 12.
Processor Top-Side Marking Example
M
INTEL
©'06 440
CELERON®
SLxxx [COO]
2.00GHZ/512/800/06
e4
[FPO]
A T P O
S/N
40
Datasheet
INTEL [ INTEL ]
