Thermal Specifications
Figure 6-3. Dual-Core Intel Xeon Processor 5063 (MV) Thermal Profile
Thermal Profile
70
TCASE_MAX@TDP
65
Thermal Profile
Y = 0.260*x + 42.3
60
55
50
45
40
0
10
20
30
40
50
60
70
80
90
100
Power [W]
Notes:
1.
Thermal Profile is representative of a volumetrically constrained platform. Please refer to Table 6-8 for
discrete points that constitute the thermal profile.
2.
Implementation of Thermal Profile should result in virtually no TCC activation. Furthermore, utilization of
thermal solutions that do not meet Thermal Profile will not meet the processor’s thermal specifications and
may result in permanent damage to the processor.
®
®
3.
Refer to the Dual-Core Intel Xeon Processor 5000 Series Thermal/Mechanical Design Guidelines for
system and environment implementation details.
Table 6-8.
Dual-Core Intel Xeon Processor 5063 (MV) Thermal Profile Table
Power (W)
T
(° C)
Power (W)
T
(° C)
CASE_MAX
50.0
CASE_MAX
61.8
P_profile_min =29.6
_B
75
80
85
90
95
35
40
45
50
55
60
65
70
51.4
63.1
52.7
64.4
54.0
65.7
55.3
67.0
56.6
57.9
59.2
60.5
6.1.2
Thermal Metrology
The minimum and maximum case temperatures (TCASE) specified in Table 6-2,
Table 6-3, Table 6-5, and Table 6-6 are measured at the geometric top center of the
processor integrated heat spreader (IHS). Figure 6-4 illustrates the location where
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
75
INTEL [ INTEL ]
