Thermal Specifications
Figure 6-1. Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal Profiles A
and B
TCASE_MAX is a thermal solution design point. In actuality, units will not significantly
exceed TCASE_MAX_A due to TCC activation.
85
TCASE_MAX_B@TDP
TCASE_MAX_A@TDP
80
75
70
65
60
55
50
45
40
Thermal Profile B
Y = 0.260*x + 44.2
Thermal Profile A
Y = 0.203*x + 42.6
0
10
20
30
40
50
60
70
80
90
100
110
120
130
Pow er [W]
Notes:
1.
Thermal Profile A is representative of a volumetrically unconstrained platform. Please refer to Table 6-2 for
discrete points that constitute the thermal profile.
Implementation of Thermal Profile A should result in virtually no TCC activation. Furthermore, utilization of
thermal solutions that do not meet processor Thermal Profile A will result in increased probability of TCC
activation and may incur measurable performance loss. (Refer to Section 6.2 for details on TCC activation.)
Thermal Profile B is representative of a volumetrically constrained platform. Please refer to Table 6-3 for
discrete points that constitute the thermal profile.
Implementation of Thermal Profile B will result in increased probability of TCC activation and measurable
performance loss. Furthermore, utilization of thermal solutions that do not meet Thermal Profile B do not
meet the processor’s thermal specifications and may result in permanent damage to the processor.
2.
3.
4.
®
®
5.
Refer to the Dual-Core Intel Xeon processor 5000 Series Thermal/Mechanical Design Guidelines for
system and environmental implementation details.
Table 6-2.
Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal Profile A
Table
Power (W)
T
(° C)
Power (W)
T
(° C)
CASE_MAX
50.0
CASE_MAX
59.9
P_profile_min =36.5
_A
85
90
40
45
50
55
60
65
70
75
80
50.7
60.9
51.7
95
61.9
52.8
100
105
110
115
120
125
130
62.9
53.8
63.9
54.8
64.9
55.8
65.9
56.8
67.0
57.8
68.0
58.8
69.0
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
71
INTEL [ INTEL ]
