Electrical, Power, and Thermal
4.4.12
Reference DDR2 Interface Package Trace Lengths
The following reference package trace lengths have been incorporated into the Advance
Memory Buffer timings in Table 4-9.
Table 4-9.
Advance Memory Buffer DDR2 Package Lengths
Signal Group
Min Length
Max Length
Units
CLK/CLK
24
4
26
20
22
16
13
mm
mm
mm
mm
mm
Command/Address
CKE, CS#
9
ODT
10
9
DQS/DQS/DQ
4.5
SMBUS Interface
Table 4-10. Recommended Operating Conditions for SMBUS Interface
Symbol
Parameter
Min
Typ
Max
Unit
Comments
3.3v +10%
V
V
V
V
Supply voltage (SMBUS)
3.0
3.3
-
3.6
0.8
V
V
DDSPD
SMBus signal input low voltage
SMBus signal input high voltage
SMBus signal output low voltage
Input Leakage per bus segment
Input Leakage per device pin
-
2.1
-
IL
-
V
V
IH
DDSPD
-
0.4
V
@I
PULLUP
OL
I
I
I
-
-
+200
+10
-
µA
µA
mA
pF
pF
LEAK-BUS
LEAK-PIN
PULLUP
-
-
Current sinking, V = 0.4V
OL
4
-
-
C
C
Capacitive load per bus segment
-
400
10
BUS
Capacitance for SMBDAT or
SMBCLK pin
-
-
I
V
Signal noise immunity from
10MHz to 100MHz
300
-
-
mV p-p
This is AC item applies to
the high-power DC
specification only
NOISE
Note: Based on High-power SMBus DC Specification
4.6
Miscellaneous I/O (1.5 Volt CMOS Driver)
Table 4-11. Recommended Operating Conditions for RESET and BFUNC Pins
Symbol
Parameter
Min
Typ
Max
Unit
Comments
V
V
DC HIGH-level input voltage
DC LOW-level input voltage
Input leakage
1.0
-
-
-
-
V
V
IH(dc)
IL(dc)
-
-
0.5
ILEAK
+ 90
µA
4.7
Thermal Diode and Analog to Digital Converter
(ADC)
A thermal diode with an analog to digital converter (ADC) is required. The thermal
sensor will be used to ensure prevention of catastrophic failure.
Intel® 6400/6402 Advanced Memory Buffer Datasheet
51
INTEL [ INTEL ]
