Mechanical Specifications
3 Mechanical Specifications
The Dual-Core Intel Xeon Processor 5000 series are packaged in a Flip Chip Land Grid
Array (FC-LGA6) package that interfaces to the baseboard via a LGA771 socket. The
package consists of a processor core mounted on a pinless substrate with 771 lands. An
integrated heat spreader (IHS) is attached to the package substrate and core and
serves as the interface for processor component thermal solutions such as a heatsink.
Figure 3-1 shows a sketch of the processor package components and how they are
assembled together. .
The package components shown in Figure 3-1 include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor Core (die)
4. Package Substrate
5. Landside capacitors
6. Package Lands
Figure 3-1. Processor Package Assembly Sketch
TIM
Core (die)
IHS
Substrate
Package Lands
Capacitors
LGA771 Socket
System Board
Note: This drawing is not to scale and is for reference only.
3.1
Package Mechanical Drawings
The package mechanical drawings are shown in Figure 3-2 through Figure 3-4. The
drawings include dimensions necessary to design a thermal solution for the processor
including:
1. Package reference and tolerance dimensions (total height, length, width, an so
forth)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keepout dimensions
5. Reference datums
Note:
All drawing dimensions are in mm [in.].
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
33
INTEL [ INTEL ]
