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313062 参数 Datasheet PDF下载

313062图片预览
型号: 313062
PDF下载: 下载PDF文件 查看货源
内容描述: 双核英特尔​​®至强®处理器 [Dual-Core Intel Xeon Processor]
分类和应用:
文件页数/大小: 104 页 / 3687 K
品牌: INTEL [ INTEL ]
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Introduction  
1.1  
Terminology  
A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in  
the asserted state when driven to a low level. For example, when RESET# is low, a  
reset has been requested. Conversely, when NMI is high, a nonmaskable interrupt has  
occurred. In the case of signals where the name does not imply an active state but  
describes part of a binary sequence (such as address or data), the ‘#’ symbol implies  
that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A, and  
D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).  
Commonly used terms are explained here for clarification:  
Dual-Core Intel® Xeon® Processor 5000 Series – Processor in the FC-LGA6  
package with two physical processor cores. Dual-Core Intel Xeon processor 5000  
series refers to the “Full Power” Dual-Core Intel Xeon Processor 5000 series with  
1066 MHz Front Side Bus. For this document, “processor” is used as the generic  
term for the “Dual-Core Intel® Xeon® Processor 5000 series.  
Dual-Core Intel® Xeon® Processor 5063 (MV) – This is a lower power version  
of the Dual-Core Intel Xeon Processor 5000 series. Dual-Core Intel Xeon Processor  
5063 (MV) refers to the “Mid Power” Dual-Core Intel Xeon Processor 5000 series.  
Unless otherwise noted, the terms “Dual-Core Intel Xeon 5000 series” and  
“processor” also refer to the “Dual-Core Intel Xeon Processor 5063.  
FC-LGA6 (Flip Chip Land Grid Array) Package – The Dual-Core Intel Xeon  
Processor 5000 series package is a Land Grid Array, consisting of a processor core  
mounted on a pinless substrate with 771 lands, and includes an integrated heat  
spreader (IHS).  
FSB (Front Side Bus) – The electrical interface that connects the processor to the  
chipset. Also referred to as the processor front side bus or the front side bus. All  
memory and I/O transactions as well as interrupt messages pass between the  
processor and chipset over the FSB.  
Functional Operation – Refers to the normal operating conditions in which all  
processor specifications, including DC, AC, FSB, signal quality, mechanical and  
thermal are satisfied.  
Storage Conditions – Refers to a non-operational state. The processor may be  
installed in a platform, in a tray, or loose. Processors may be sealed in packaging or  
exposed to free air. Under these conditions, processor lands should not be  
connected to any supply voltages, have any I/Os biased or receive any clocks.  
Upon exposure to “free air” (that is, unsealed packaging or a device removed from  
packaging material) the processor must be handled in accordance with moisture  
sensitivity labeling (MSL) as indicated on the packaging material.  
Priority Agent – The priority agent is the host bridge to the processor and is  
typically known as the chipset.  
Symmetric Agent – A symmetric agent is a processor which shares the same I/O  
subsystem and memory array, and runs the same operating system as another  
processor in a system. Systems using symmetric agents are known as Symmetric  
Multiprocessing (SMP) systems.  
Integrated Heat Spreader (IHS) – A component of the processor package used  
to enhance the thermal performance of the package. Component thermal solutions  
interface with the processor at the IHS surface.  
Enhanced Intel SpeedStep Technology – The next generation implementation  
of Intel SpeedStep technology which extends power management capabilities of  
servers and workstations.  
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet  
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