Package Mechanical Specifications
3.5
3.6
Package Insertion Specifications
The Celeron D processor can be inserted into and removed from a LGA775 socket 15
times. The socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
Processor Mass Specification
The typical mass of the Celeron D processor is 21.5 g [0.76 oz]. This mass [weight]
includes all the components that are included in the package.
3.7
Processor Materials
Table 22 lists some of the package components and associated materials.
Table 22.
Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Substrate
Nickel Plated Copper
Fiber Reinforced Resin
Gold Plated Copper
Substrate Lands
3.8
Processor Markings
Figure 8 shows the topside markings on the processor. This diagram is to aid in the
identification of the Celeron D processor.
Figure 8.
Processor Top-Side Marking Example
Brand
Processor Number/ S-Spec/
Country of Assy
Frequency/L2 Cache/Bus/FMB
FPO
m
INTEL
‘05
©
XXXXXXXX
356 SLxxx [COO]
3.33GHZ/512K/533/05A
[FPO]
Unique Unit
Identifier
2-D Matrix Mark
ATPO Serial #
ATPO
S/N
38
Datasheet
INTEL [ INTEL ]
