Package Mechanical Specifications
3.5
Package Insertion Specifications
The Celeron D processor can be inserted into and removed from a LGA775 socket 15
times. The socket should meet the LGA775 requirements detailed in the
LGA775 Socket
Mechanical Design Guide.
3.6
Processor Mass Specification
The typical mass of the Celeron D processor is 21.5 g [0.76 oz]. This mass [weight]
includes all the components that are included in the package.
3.7
Table 22.
Processor Materials
lists some of the package components and associated materials.
Processor Materials
Component
Integrated Heat Spreader (IHS)
Substrate
Substrate Lands
Material
Nickel Plated Copper
Fiber Reinforced Resin
Gold Plated Copper
3.8
Processor Markings
shows the topside markings on the processor. This diagram is to aid in the
identification of the Celeron D processor.
Figure 8.
Processor Top-Side Marking Example
Brand
Processor Number/ S-Spec/
Country of Assy
Frequency/L2 Cache/Bus/FMB
FPO
INTEL
m
©
‘05
XXXXXXXX
356 SLxxx [COO]
3.33GHZ/512K/533/05A
[FPO]
Unique Unit
Identifier
ATPO Serial #
ATPO
S/N
2-D Matrix Mark
38
Datasheet
INTEL [ INTEL CORPORATION ]
