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300 参数 Datasheet PDF下载

300图片预览
型号: 300
PDF下载: 下载PDF文件 查看货源
内容描述: 赛扬D处理器 [Celeron D Processor]
分类和应用:
文件页数/大小: 95 页 / 2070 K
品牌: INTEL [ INTEL ]
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Electrical Specifications  
2.2.2  
V Decoupling  
TT  
Decoupling must be provided on the motherboard. Decoupling solutions must be sized  
to meet the expected load. To insure compliance with the specifications, various factors  
associated with the power delivery solution must be considered including regulator  
type, power plane and trace sizing, and component placement. A conservative  
decoupling solution would consist of a combination of low ESR bulk capacitors and high  
frequency ceramic capacitors.  
2.2.3  
FSB Decoupling  
The processor integrates signal termination on the die. In addition, some of the high  
frequency capacitance required for the FSB is included on the processor package.  
However, additional high frequency capacitance must be added to the motherboard to  
properly decouple the return currents from the front side bus. Bulk decoupling must  
also be provided by the motherboard for proper [A]GTL+ bus operation.  
2.3  
Voltage Identification  
The Voltage Identification (VID) specification for the processor is defined by the Voltage  
Regulator-Down (VRD) 10.1 Design Guide For Desktop and Transportable LGA775  
Socket. The voltage set by the VID signals is the reference VR output voltage to be  
delivered to the processor VCC lands (see Section 2.5.3 for VCC overshoot  
specifications). Refer to Table 14 for the DC specifications for these signals. A minimum  
voltage for each processor frequency is provided in Table 4.  
Individual processor VID values may be calibrated during manufacturing such that two  
devices at the same core speed may have different default VID settings. This is  
reflected by the VID Range values provided in Table 4. Refer to the Intel® Celeron®  
D
Processor 300 Sequence Specification Update for further details on specific valid core  
frequency and VID values of the processor.  
The processor uses 6 voltage identification signals, VID[5:0], to support automatic  
selection of power supply voltages. Table 2 specifies the voltage level corresponding to  
the state of VID[5:0]. A ‘1’ in this table refers to a high voltage level and a ‘0’ refers to  
a low voltage level. If the processor socket is empty (VID[5:0] = x11111), or the  
voltage regulation circuit cannot supply the voltage that is requested, it must disable  
itself. Refer to the Voltage Regulator-Down (VRD) 10.1 Design Guide For Desktop and  
Transportable LGA775 Socket for further details.  
The processor provides the ability to operate while transitioning to an adjacent VID and  
its associated processor core voltage (VCC). This will represent a DC shift in the load  
line. Note that a low-to-high or high-to-low voltage state change may result in as many  
VID transitions as necessary to reach the target core voltage. Transitions above the  
specified VID are not permitted. Table 4 includes VID step sizes and DC shift ranges.  
Minimum and maximum voltages must be maintained as shown in Table 5 and Figure 1  
as measured across the VCC_SENSE and VSS_SENSE lands.  
The VRM or VRD used must be capable of regulating its output to the value defined by  
the new VID. DC specifications for dynamic VID transitions are included in Table 4, and  
Table 5. Refer to the Voltage Regulator-Down (VRD) 10.1 Design Guide For Desktop  
and Transportable LGA775 Socket for further details.  
14  
Datasheet  
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