Introduction
1.1.1
Processor Packaging Terminology
Commonly used terms are explained here for clarification:
• Intel® Celeron® D Processor 300 sequence on 65 nm process in the 775-
land Package— Processor in the FC-LGA6 package with a 512 KB L2 cache.
• Processor — For this document, the term processor is the generic form of the
Celeron D processor.
• Keep-out zone — The area on or near the processor that system design can not
use.
• Intel® 945G/945GZ/945P/945PL Express chipset family — Chipset that
supports DDR and DDR2 memory technology for the Celeron D processor on 65 nm
process.
• Processor core — Processor core die with integrated L2 cache.
• LGA775 socket — The Celeron D processor on 65 nm process mates with the
system board through a surface mount, 775-land, LGA socket.
• Integrated heat spreader (IHS) —A component of the processor package used
to enhance the thermal performance of the package. Component thermal solutions
interface with the processor at the IHS surface.
• Retention mechanism (RM) — Since the LGA775 socket does not include any
mechanical features for heatsink attach, a retention mechanism is required.
Component thermal solutions should attach to the processor via a retention
mechanism that is independent of the socket.
• FSB (Front Side Bus) — The electrical interface that connects the processor to
the chipset; also referred to as the processor system bus or the system bus. All
memory and I/O transactions as well as interrupt messages pass between the
processor and chipset over the FSB.
• Storage conditions — Refers to a non-operational state. The processor may be
installed in a platform, in a tray, or loose. Processors may be sealed in packaging or
exposed to free air. Under these conditions, processor lands should not be
connected to any supply voltages, have any I/Os biased, or receive any clocks.
Upon exposure to “free air”(i.e., unsealed packaging or a device removed from
packaging material) the processor must be handled in accordance with moisture
sensitivity labeling (MSL) as indicated on the packaging material.
• Functional operation — Refers to normal operating conditions in which all
processor specifications, including DC, AC, system bus, signal quality, mechanical
and thermal are satisfied.
10
Datasheet
INTEL [ INTEL ]
