Package Mechanical Specifications
Figure 3-5. IHS Flatness Specification
IHS
SUBSTRATE
NOTES:
1. Flatness is specific as overall, not per unit of length.
2. All Dimensions are in millimeters.
3.1
Package Load Specifications
Table 3-2 provides dynamic and static load specifications for the processor IHS. These mechanical
load limits should not be exceeded during heatsink assembly, mechanical stress testing, or standard
drop and shipping conditions. The heatsink attach solutions must not induce continuous stress onto
the processor with the exception of a uniform load to maintain the heatsink-to-processor thermal
interface contact. It is not recommended to use any portion of the processor substrate as a
mechanical reference or load bearing surface for thermal solutions.
Table 3-2. Package Dynamic and Static Load Specifications
Parameter
Static
Max
Unit
Notes
100
200
lbf
lbf
1, 2
1, 3
Dynamic
NOTES:
1. This specification applies to a uniform compressive load.
2. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and
processor interface.
3. Dynamic loading specifications are defined assuming a maximum duration of 11 ms and 200 lbf is achieved
by superimposing a 100 lbf dynamic load (1 lbm at 50 g) on the static compressive load.
40
Intel® Pentium® 4 Processor on 0.13 Micron Process Datasheet
INTEL [ INTEL ]
