Package Mechanical Specifications
Package Mechanical Specifications 3
The Pentium 4 processor on 0.13 micron process is packaged in a Flip-Chip Pin Grid Array
(FC-PGA2) package. Components of the package include an integrated heat spreader (IHS),
processor die, and the substrate which is the pin carrier. Mechanical specifications for the processor
are given in this section. See Section 1.1. for a terminology listing. The processor socket that
accepts the Pentium 4 processor on 0.13 micron process is referred to as a 478-Pin micro PGA
(mPGA478B) socket. See the Intel® Pentium® 4 Processor 478-Pin Socket (mPGA478B) Socket
Design Guidelines for complete details on the mPGA478B socket.
Note: For Figure 3-1 through Figure 3-8, the following notes apply:
1. Unless otherwise specified, the following drawings are dimensioned in millimeters.
2. Figures and drawings labelled as “Reference Dimensions” are provided for informational
purposes only. Reference dimensions are extracted from the mechanical design database and
are nominal dimensions with no tolerance information applied. Reference dimensions are not
checked as part of the processor manufacturing process. Unless noted as such, dimensions in
parentheses without tolerances are reference dimensions.
3. Drawings are not to scale.
Note: Figure 3-1 is not to scale and is for reference only. The socket and system board are supplied as a
reference only.
Figure 3-1. Exploded View of Processor Components on a System Board
Heat Spreader
31 mm
3.5mm
2.0mm
Substrate
478 pins
35mm square
mPGA478B
Socket
System board
Intel® Pentium® 4 Processor on 0.13 Micron Process Datasheet
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INTEL [ INTEL ]
